Характеристики
Характеристики
Чипсет | Intel Z170 Express |
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Процесор | Support for Intel Core i7 processors/Intel Core i5 processors/ Intel Core i3 processors/Intel Pentium processors/ Intel Celeron processors in the LGA1151 package |
Памет | 4 x DDR4 DIMM sockets supporting up to 64 GB of system memory, Dual channel memory architecture, Support for DDR4 3866(O.C)/3733(O.C)/3666(O.C) /3600(O.C.) /3466(O.C.) /3400(O.C.) /3333(O.C.) /3300(O.C.) /3200(O.C.) /3000(O.C.) /2800(O.C.) /2666(O.C.) /24 |
Multi-GPU Support | Support for 3-Way/2-Way AMD CrossFire and 2-Way NVIDIA SLI Technology |
Портове | 1 x PS/2 keyboard/mouse port, 1 x DisplayPort, 1 x HDMI port, 1 x USB Type-C port, with USB 3.1 support; 1 x USB 3.1 port; 5 x USB 3.0/2.0 ports; 2 x RJ-45 ports; 1 x optical S/PDIF Out connector; 5 x audio jacks (Center/Subwoofer Speaker Out, Rear Speake |
Слотове | 1 x PCI Express x16 slot, running at x16 (PCIEX16), 1 x PCI Express x16 slot, running at x8 (PCIEX8), 1 x PCI Express x16 slot, running at x4 (PCIEX4), 3 x PCI Express x1 slots |
Конектори | 1 x 24-pin ATX main power connector; 1 x 8-pin ATX 12V power connector; 2 x M.2 Socket 3 connectors; 3 x SATA Express connectors; 8 x SATA 6Gb/s connectors; 1 x I/O shield audio LED power connector; 1 x CPU fan header; 1 x water cooling fan header (CPU_OPT); 3 x system fan headers; 1 x front panel header; 1 x front panel audio header; 2 x USB 3.0/2.0 headers; 2 x USB 2.0/1.1 headers; 1 x Trusted Platform Module (TPM) header; 1 x serial port header; 1 x Clear CMOS jumper; 1 x power button; 1 x reset button; 1 x Clear CMOS button; 1 x ECO button; 1 x OC button; 1 x audio gain control switch; Voltage Measurement Points; 1 x BIOS switch; |
Дисков интерфейс | 2 x M.2 Socket 3 connectors, 3 x SATA Express connectors, 6 x SATA 6Gb/s connectors (SATA3 0~5), Support for RAID 0, RAID 1, RAID 5, and RAID 10 |
Видео | 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz; Integrated Graphics Processor+MegaChips MCDP2800 chip: 1 x HDMI 2.0 port |
Аудио | Creative Sound Core 3D chip, Support for Sound Blaster Recon3Di, TI Burr Brown OPA2134 operational amplifier, High Definition Audio, 2/5.1-channel, Support for S/PDIF Out |
LAN | 1 x Intel GbE LAN chip (10/100/1000 Mbit)(LAN1), 1 x Qualcomm Atheros Killer E2400 chip (10/100/1000 Mbit) (LAN2) |
BIOS | 2 x 128 Mbit flash, Use of licensed AMI UEFI BIOS, Support for DualBIOS, PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
Форм фактор | ATX Form Factor; 30.5cm x 24.4cm |
Аксесоари | Creative Sound Core 3D chip, Support for Sound Blaster Recon3Di, TI Burr Brown OPA2134 operational amplifier, High Definition Audio, 2/5.1-channel, Support for S/PDIF Out |
Гаранционен срок | 36 месеца |